1 / 7
Resin-Bond Diamond Segments HTG-C3010F
The HTG-C3010F is a resin-bond diamond segment designed for fine polishing of concrete, marble, granite, and terrazzo floors. Available in grits from 50# to 1500#, it delivers smooth surface finishes and consistent polishing results. The 80mm x 10mm pad size fits standard floor grinders, making it an ideal choice for professional flooring contractors working on fine surface finishing.
Produk Serupa
Butuh bantuan memilih pengaturan yang tepat?
1 / 7
Resin-Bond Diamond Segments HTG-C3010F
Opsi Konfigurasi
Hanya pertahankan varian yang benar-benar memengaruhi penawaran dan pemilihan.
* Opsi wajib
Ikhtisar Produk
Resin-Bond Diamond Segments HTG-C3010F
The HTG-C3010F is a resin-bond diamond…
The HTG-C3010F is a resin-bond diamond segment designed for fine polishing of concrete, marble, granite, and terrazzo floors. Available in grits from 50# to 1500#, it delivers smooth surface finishes and consistent polishing results. The 80mm x 10mm pad size fits standard floor grinders, making it an ideal choice for professional flooring contractors working on fine surface finishing.
- ID Produk
- Resin-Bond Diamond Segments HTG-C3010F
- Kategori
- Resin-Bond Polishing Pads
Produk Serupa
Parameter Teknis
Spesifikasi terpilih saat ini
Catatan: Spesifikasi produk dapat berubah seiring peningkatan berkelanjutan. Silakan merujuk pada proposal penjualan akhir.
Butuh bantuan memilih pengaturan yang tepat?
Kirimkan kebutuhan proyek Anda dan kami akan merekomendasikan konfigurasi serta rencana penawaran yang sesuai.